Electromagnetic wave shielding film for flexible substrates
It is an electromagnetic wave shielding film for small mobile devices. It has excellent shielding properties, flexibility, and heat resistance.
■Shielding characteristics: 60 dB or more (1 GHz) ■Conductivity: 200 MΩ/□ or less ■Adhesion (to polyimide): 3.0 N/cm or more ■Heat resistance: Good heat resistance for solder reflow (260°C) ■Chemical resistance: IPA/Acetone/MEK/HCl/NaOH ■Product thickness: 22 μm, 18 μm, 12 μm
- Company：トーヨーケム株式会社（旧東洋インキ製造株式会社）
- Price：Other
